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International Conference on Electronics Packaging and Assembly Engineering

IC-EPAE

Thu, Nov 12, 2026- Fri, Nov 13, 2026
Kaunas, Lithuania

Deadline: Oct 23, 2026

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IC-EPAE

Thu, Nov 12, 2026- Fri, Nov 13, 2026
Kaunas, Lithuania

Deadline: Oct 23, 2026

Conference Overview

The main purpose of International Conference on Electronics Packaging and Assembly Engineering is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.

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Important Dates

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Designed withfor researchers

Thursday, November 12, 2026

End Date

Friday, November 13, 2026

Registration Deadline

Wednesday, October 28, 2026

Submission Deadline

Friday, October 23, 2026

Conference Agenda
TimingSessions
09:00 AM – 09:30 AMRegistration & Welcome Coffee Kit Collection
09:30 AM – 09:45 AMNetworking Tea Break
09:45 AM – 10:30 AMOpening Plenary Session: Welcome Address & Keynote
10:30 AM – 01:00 PMSession I
01:00 PM – 01:30 PMLunch Break
01:30 PM – 04:00 PMSession II
04:05 PM – 04:15 PMGroup Photo & Final Networking Session
04:15 PM – 05:00 PMClosing Address: Reflections & Awards Presentation

Committee Members

Meet the distinguished experts guiding the conference.

Abdullah Al Abri

Abdullah Al Abri

Anna Kurzych

Anna Kurzych

Ashim Saha

Ashim Saha

Speakers

Learn from renowned speakers and industry leaders.

Dr Farah Naz

Dr Farah Naz

Dr. Anila Jha

Dr. Anila Jha

Dr. Anurag Rana

Dr. Anurag Rana

Organizer

ISIT

Nathan Vincent
info@isit.org.in

Indexed In

  • Scopus
  • DOI Directory
  • Google Scholar
  • Springer
Venue

Hotel Kaunas

LaisvÄ—s al. 79,

Kaunas 44297,

Lithuania

Kaunas, Lithuania

Quick Info
TypeConference
CountryLithuania
MonthNov-26

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